TeraFlash smart
Ultrafast Time-Domain Terahertz Platform – Fast measurements of complete terahertz waveforms with 1600 pulse traces / sec
- 1600 pulse traces / sec
- Proprietary and patented ECOPS technology
- Robust design, no mechanical delay line
- Time-domain dynamic range: 50 dB in < 1 ms, 80 dB in 1 s
- Spectral bandwidth: 3 THz in < 1 ms, 4 THz in 1 s
TOPTICA’s TeraFlash smart utilizes a proprietary scheme dubbed ECOPS ("electronically controlled optical sampling"). The system comprises two synchronized femtosecond lasers, eliminating the need for a mechanical delay. This results in extremely high measurement speeds: the TeraFlash smart acquires 1600 complete terahertz waveforms per second, enabling terahertz-based thickness gauging at unprecedented speed. The system thus lends itself to measurements on rapidly moving samples, e.g. conveyor belts, papermaking machines, or extrusion lines. Learn more about TOPTICA's advanced terahertz solutions.
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Specification
Specifications TeraFlash smart Scan speed 1600 traces/s (150 ps)
800 traces/s (300 ps)
200 traces/s (700 ps)Spectral range 0.1 – 4 THz, in < 1 s Spectral peak dynamic range typ. 35 dB in < 1 ms
> 60 dB in 1 sec - Additional Information
- Applications
- Downloads
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Literature
- Publication: M. Yahyapour et al., Fastest thickness measurements with a terahertz time-domain system based on electronically controlled optical sampling; Appl. Sciences (2019)
- Conference proceeding: Yahyapour et al., Extremely fast thickness measurements with an ECOPS-based TD-THz system, IRMMW-THz 2018
- Conference proceeding: Yahyapour et al., Non-Contact Thickness Measurements with Terahertz Pulses, WCNDT 2016
- Scientific paper: Dietz et al., All fiber-coupled THz-TDS system with kHz measurement rate based on electronically controlled optical sampling; Opt. Lett. (2014)
- Review paper: Naftaly, M., et al., Industrial applications of terahertz sensing: State of play, Sensors (2019)
- Scientific paper: Damyanov, D., et al., High resolution lensless terahertz imaging and ranging, IEEE Access (2019)
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